商品图片 | 商品描述 | 型号 | 厂牌 | 库存数量 | 操作 |
---|---|---|---|---|---|
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W9816G6JH-6 |
W9816G6JH-6
标记: 封装:TSOP-50-10.0mm |
WINBOND(华邦) | 10000 | 立即订购 |
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W9825G6KH-6 TR |
W9825G6KH-6 TR
标记: 封装:TSOPII-54-10.2mm |
WINBOND(华邦) | 10000 | 立即订购 |
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W66CP2NQUAFJ |
W66CP2NQUAFJ
标记: 封装:WFBGA-200(10x14.5) |
WINBOND(华邦) | 10000 | 立即订购 |
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W989D2DBJX6E 512Mbit 166MHz 1.7V~1.95V -25℃~+85℃ |
W989D2DBJX6E
标记: 封装:VFBGA-90(8x13) |
WINBOND(华邦) | 10000 | 立即订购 |
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W989D6DBGX6I 512Mbit 166MHz 1.7V~1.95V -40℃~+85℃ |
W989D6DBGX6I
标记: 封装:VFBGA-54(8x9) |
WINBOND(华邦) | 10000 | 立即订购 |
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K4S510432D-UC75 3V~3.6V |
K4S510432D-UC75
标记: 封装:TSOP-54-10.2mm |
SAMSUNG(三星半导体) | 10000 | 立即订购 |
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K4S510432D-UC75T00 3V~3.6V |
K4S510432D-UC75T00
标记: 封装:TSOP-54-10.2mm |
SAMSUNG(三星半导体) | 10000 | 立即订购 |
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MD56V62160M-7TAZ0AX 64Mbit 143MHz 3V~3.6V 0℃~+70℃ |
MD56V62160M-7TAZ0AX
标记: 封装:TSOPII-54-10.2mm |
ROHM(罗姆) | 10000 | 立即订购 |
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MSM56V16160K8T3K |
MSM56V16160K8T3K
标记: 封装:TSOP-50-10.0mm |
ROHM(罗姆) | 10000 | 立即订购 |
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HYB18T1G800BF-3S |
HYB18T1G800BF-3S
标记: 封装:- |
QIMONDA | 10000 | 立即订购 |
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HYB25D512800CE-5 |
HYB25D512800CE-5
标记: 封装:TSOPII-66 |
QIMONDA | 10000 | 立即订购 |
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HYB25D512800CE-6 |
HYB25D512800CE-6
标记: 封装:66-TSOP II |
QIMONDA | 10000 | 立即订购 |