| 商品描述 |
供应商型号 |
厂牌 |
说明 |
库存 |
|
ZEYTPI.0530.4R7M 4.7uH ±20% 4.5A 6A
|
ZEYTPI.0530.4R7M
标记: 封装:SMD,5.4x5.2mm
|
ZE(增益) |
批号:25+
|
265 起订 |
|
ZEYTPI.0530.3R3M 3.3uH ±20% 5.5A 7A
|
ZEYTPI.0530.3R3M
标记: 封装:SMD,5.4x5.2mm
|
ZE(增益) |
批号:25+
|
265 起订 |
|
ZEMS0630-R22M 220nH ±20% 25A 35A
|
ZEMS0630-R22M
标记: 封装:SMD,6.6x7mm
|
ZE(增益) |
批号:25+
|
265 起订 |
|
SPK0810-472MB 4.7mH ±20% 130mA 7Ω
|
SPK0810-472MB
标记: 封装:插件,D9xL13mm
|
LanTu Micro(蓝图微电) |
批号:25+
|
265 起订 |
|
XR6*10-402K-L 4mH ±10% 10.5Ω
|
XR6*10-402K-L
标记: 封装:插件,D6xL10mm
|
XR(祥如) |
批号:25+
|
265 起订 |
|
BLM31PG330SZ1L 33Ω@100MHz ±25% 9mΩ 6A
|
BLM31PG330SZ1L
标记: 封装:1206
|
muRata(村田) |
批号:25+
|
265 起订 |
|
W25Q32JWSSIQ SPI 32Mbit 133MHz 1.7V~1.95V
|
W25Q32JWSSIQ
标记: 封装:SOIC-8-208mil
|
WINBOND(华邦) |
批号:25+
|
265 起订 |