| 类型Type | Ceramic |
| 谐振频率Frequency | 8MHz |
| 频率容差Frequency Tolerance | ±0.5% |
| 频率稳定性Frequency Stability | ±0.2% |
| 负载电容Load Capacitance | 21pF |
| 谐振阻抗Resonant impedance | |
| Description & Applications | FEATURES • Encased in a ceramic package • High reliability against soldering heat and mechanical stress • Moisture-proof sealing • 1.2 mm maximum (SS/SM/BM/JM),0.8 mm maximum (ST) in thickness • Designed for refl ow soldering • Flat-bottom plate for better mountings • Simplifi es oscillation circuits by reducing the number of circuit parts • RoHS compliant |
| 描述与应用 | 特点 •陶瓷封装包 •高可靠性，以防止焊接热和机械应力 •防潮密封 •1.2毫米最大（SS/ SM/ BM/ JM），0.8毫米的厚度最大（ST） •专为回流焊接 •平底板更好的架 Simplifi上课振荡电路，通过减少电路部件的数量 •符合RoHS标准 |
| 规格书PDF |
