商品描述
|
供应商型号
|
厂牌
|
说明
|
库存
|
IS43DR82560C-25DBL
|
IS43DR82560C-25DBL
标记:
封装:TWBGA-60(8x10.5)
|
ISSI(美国芯成)
|
批号:25+
|
10000
起订
|
W972GG8KS-18
|
W972GG8KS-18
标记:
封装:WBGA-60(8x9.5)
|
WINBOND(华邦)
|
批号:25+
|
10000
起订
|
IS43DR82560C-3DBL
|
IS43DR82560C-3DBL
标记:
封装:TWBGA-60(8x10.5)
|
ISSI(美国芯成)
|
批号:25+
|
10000
起订
|
MT47H256M8EB-25E:C TR
|
MT47H256M8EB-25E:C TR
标记:
封装:FBGA-60(9x11.5)
|
micron(镁光)
|
批号:25+
|
10000
起订
|
W972GG6KB-18 SDRAM DDR2 2Gbit 1.7V~1.9V 85mA
|
W972GG6KB-18
标记:
封装:WBGA-84(8x12.5)
|
WINBOND(华邦)
|
批号:25+
|
10000
起订
|
W972GG8KS25I
|
W972GG8KS25I
标记:
封装:WBGA-60(8x9.5)
|
WINBOND(华邦)
|
批号:25+
|
10000
起订
|
IS43LR32640A-6BL SDRAM DDR 166MHz 2Gbit 1.7V~1.95V
|
IS43LR32640A-6BL
标记:
封装:WBGA-90(8x13)
|
ISSI(美国芯成)
|
批号:25+
|
10000
起订
|
K3QF6F60AM-FGCF
|
K3QF6F60AM-FGCF
标记:
封装:FBGA-256
|
SAMSUNG(三星半导体)
|
批号:25+
|
10000
起订
|